GlobalFoundries
Semi supply chain · US
GlobalFoundries had a market capitalisation of $26B on 16 October 2026 (listed as GFS; updated every weekday from the market price).
Mature-node foundry; not leading-edge AI but essential supporting silicon - and from 2026 a US source of advanced-packaging substrate.
- Valuation
- $26B
- Confidence
- verified
- As of
- 16 October 2026
- Layer
- Semi supply chain
- Ticker
- GFS
- Signal
- TSMC interposers
- Website
- gf.com
Relationships (3)
GlobalFoundries fabricates for
- TSMCverified · source
- Lightmatterverified · source
Valuation history on the map
| Date | Mark | Change |
|---|---|---|
| 15 October 2026 | $27.2B | +4.4% |
| 14 October 2026 | $26B | -3.4% |
| 13 October 2026 | $26.9B | +0.2% |
| 10 October 2026 | $26.9B | -2.3% |
| 9 October 2026 | $27.5B | +2.7% |
| 8 October 2026 | $26.8B | -1.2% |
| 7 October 2026 | $27.1B | +0.1% |
| 6 October 2026 | $27.1B | -3.2% |
| 3 October 2026 | $28B | +3.1% |
| 2 October 2026 | $27.1B | +1.6% |
| 1 October 2026 | $26.7B | +0.1% |
| 30 September 2026 | $26.7B | +0.2% |
| 29 September 2026 | $26.6B | -2.5% |
| 26 September 2026 | $27.3B | +4.1% |
| 24 September 2026 | $26.2B | +1.4% |
Daily snapshots began 27 July 2026. Public companies move with the market every weekday.
Notes
Mature-node foundry; not leading-edge AI but essential supporting silicon - and from 2026 a US source of advanced-packaging substrate. Announced on 2026-10-08 a $2B agreement with TSMC, initial term five years, to make silicon interposers with embedded deep trench capacitors for TSMC's CoWoS packaging at its Malta, New York fab, with volume ramping in H1 2028 and a framework for later capacity expansion. It would be the first US-based source of interposers for CoWoS, the packaging step that has been the binding constraint on AI accelerator supply; GF shares rose as much as 7%.
Sources
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Last updated 16 October 2026. Follow GlobalFoundries in any feed reader to hear when its valuation moves.
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